➀ Amkor Technology begins construction of a $7 billion advanced semiconductor packaging and testing campus in Arizona, in partnership with the Trump Administration;

➁ The expanded investment adds cleanroom capacity and a second greenfield packaging facility, enhancing production capabilities;

➂ The facility aims to strengthen the U.S. semiconductor supply chain with cutting-edge packaging technologies.

➀ Ex-Intel CEO Pat Gelsinger advises Japan's Rapidus to develop unique differentiating technologies beyond production efficiency to compete with TSMC.

➁ Rapidus plans to integrate wafer fabrication and advanced packaging at the same facility for faster cycles, though full automation will not be available immediately from 2027.

➂ The company aims to begin 2nm test production with GAA transistors and establish a chiplets R&D center, utilizing ASML EUV lithography tools for future HBM and 3D packaging.

➀ The semiconductor industry is experiencing transformative growth potential.

➁ Chiplets, artificial intelligence, and advanced packaging are driving this growth.

➂ Foundry capacity is being pushed as a result.

➀ ASML and imec have signed a new strategic partnership agreement, focusing on research and sustainability.

➁ The agreement aims to deliver valuable solutions in two areas: advancing the semiconductor industry and developing sustainable innovation initiatives.

➂ The collaboration includes ASML's full product portfolio, focusing on high-end nodes and advanced technologies.

➀ Huzhou team secures hundreds of millions in financing to break international chip packaging monopoly;

➁ Jingtong Technology, a wafer-level fan-out packaging and Chiplet integration solution provider, focuses on advanced packaging technology;

➂ The market for advanced packaging is growing rapidly, with fan-out packaging and Chiplet integration expected to see significant growth.